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Education
  • 2018 - Ph.D., The Hong Kong University of Sci. & Tech.
  • 2012 - B.S., Fudan University, Shanghai, China
Professional Records (since IPEL)
  • 2020 - Joined Qualcomm as Senior Design Engineer
  • 2018 - Joined Oregon State University as Postdoctoral Researcher
  • 2018 - Continue working as Research Assistant in IPEL, HKUST
  • 2018 - Attained Ph.D. degree
  • 2012 - Joined; Supervisor: Prof. Wing-Hung Ki